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Ultra-thin BCB bonding for heterogeneous integration of III-V devices and SOI photonic components

dc.contributor.authorRoelkens, Gunther
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorChristiaens, Ilse
dc.contributor.authorBaets, Roel
dc.contributor.authorSmit, Meint
dc.date.accessioned2021-10-16T04:35:18Z
dc.date.available2021-10-16T04:35:18Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11117
dc.sourceIIOimport
dc.titleUltra-thin BCB bonding for heterogeneous integration of III-V devices and SOI photonic components
dc.typeProceedings paper
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.imecauthorBaets, Roel
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.contributor.orcidimecBaets, Roel::0000-0003-1266-1319
dc.source.peerreviewno
dc.source.conference12th European Conference on Integrated Optics (ECIO)
dc.source.conferencedate6/04/2005
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - imec


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