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Role of dielectric and barrier integrity in reliability of sub-100nm copper low-k interconnect

dc.contributor.authorTokei, Zsolt
dc.contributor.authorVan Aelst, Joke
dc.contributor.authorWaldfried, C.
dc.contributor.authorEscorcia, O.
dc.contributor.authorRoussel, Philippe
dc.contributor.authorRichard, Olivier
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-16T05:45:40Z
dc.date.available2021-10-16T05:45:40Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11327
dc.sourceIIOimport
dc.titleRole of dielectric and barrier integrity in reliability of sub-100nm copper low-k interconnect
dc.typeProceedings paper
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorVan Aelst, Joke
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.source.peerreviewno
dc.source.beginpage495
dc.source.endpage500
dc.source.conference43rd Annual IEEE International Reliability Physics Symposium Proceedings
dc.source.conferencedate17/04/2005
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - imec


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