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Role of dielectric and barrier integrity in reliability of sub-100nm copper low-k interconnect
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Authors
Tokei, Zsolt
;
Van Aelst, Joke
;
Waldfried, C.
;
Escorcia, O.
;
Roussel, Philippe
;
Richard, Olivier
;
Travaly, Youssef
;
Beyer, Gerald
;
Maex, Karen
Conference
43rd Annual IEEE International Reliability Physics Symposium Proceedings
Title
Role of dielectric and barrier integrity in reliability of sub-100nm copper low-k interconnect
Publication type
Proceedings paper
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