Publication:

Role of dielectric and barrier integrity in reliability of sub-100nm copper low-k interconnect

Date

2005
Proceedings Paper
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dc.contributor.authorTokei, Zsolt
dc.contributor.authorVan Aelst, Joke
dc.contributor.authorWaldfried, C.
dc.contributor.authorEscorcia, O.
dc.contributor.authorRoussel, Philippe
dc.contributor.authorRichard, Olivier
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorVan Aelst, Joke
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.date.accessioned2021-10-16T05:45:40Z
dc.date.available2021-10-16T05:45:40Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11327
dc.source.beginpage495
dc.source.conference43rd Annual IEEE International Reliability Physics Symposium Proceedings
dc.source.conferencedate17/04/2005
dc.source.conferencelocationSan Jose, CA USA
dc.source.endpage500
dc.title

Role of dielectric and barrier integrity in reliability of sub-100nm copper low-k interconnect

dc.typeProceedings paper
dspace.entity.typePublication
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