Publication:

Role of dielectric and barrier integrity in reliability of sub-100nm copper low-k interconnect

Date

2005

Proceedings Paper

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Author(s)

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Van Aelst, Joke

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Roussel, Philippe

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Richard, Olivier

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Travaly, Youssef

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Statistics

1909 since deposited on 2021-10-16

Acq. date: 2026-02-24