Authors

Vandecasteele, Bjorn; Vanfleteren, Jan; Manessis, D.; Ostmann, A.; Hagedorn, H.W.; Wiese, J

Conference

Proceedings of the 15th European Microelectronics and Packaging Conference and Exhibition - EPMC

Title

Lead-free flip chip: a comparison between lead-free solder and adhesives

Publication type

Proceedings paper