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Lead-free flip chip: a comparison between lead-free solder and adhesives
Publication:
Lead-free flip chip: a comparison between lead-free solder and adhesives
Date
2005-06
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandecasteele, Bjorn
;
Vanfleteren, Jan
;
Manessis, D.
;
Ostmann, A.
;
Hagedorn, H.W.
;
Wiese, J
Journal
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1891
since deposited on 2021-10-16
Acq. date: 2025-10-28
Citations
Metrics
Views
1891
since deposited on 2021-10-16
Acq. date: 2025-10-28
Citations