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Lead-free flip chip: a comparison between lead-free solder and adhesives

dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorManessis, D.
dc.contributor.authorOstmann, A.
dc.contributor.authorHagedorn, H.W.
dc.contributor.authorWiese, J
dc.date.accessioned2021-10-16T06:28:57Z
dc.date.available2021-10-16T06:28:57Z
dc.date.issued2005-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11450
dc.sourceIIOimport
dc.titleLead-free flip chip: a comparison between lead-free solder and adhesives
dc.typeProceedings paper
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.source.peerreviewno
dc.source.beginpage434
dc.source.endpage439
dc.source.conferenceProceedings of the 15th European Microelectronics and Packaging Conference and Exhibition - EPMC
dc.source.conferencedate12/06/2005
dc.source.conferencelocationBrugge Belgium
imec.availabilityPublished - imec


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