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Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect

dc.contributor.authorZhang, Wenqi
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorVan Aelst, Joke
dc.contributor.authorRichard, Olivier
dc.contributor.authorBamal, Mandeep
dc.contributor.authorHeylen, Nancy
dc.contributor.authorLi, Yunlong
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-16T07:27:01Z
dc.date.available2021-10-16T07:27:01Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11603
dc.sourceIIOimport
dc.titleImpact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect
dc.typeOral presentation
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorVan Aelst, Joke
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceAdvanced Metallization Conference
dc.source.conferencedate27/09/2005
dc.source.conferencelocationColorado Springs, CO USA
imec.availabilityPublished - open access
imec.internalnotesProceedings to be publ. by MRS in 2006. See C14250


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