Authors

Zhang, Wenqi; Brongersma, Sywert; Van Aelst, Joke; Richard, Olivier; Bamal, Mandeep; Heylen, Nancy; Li, Yunlong; Beyer, Gerald; Maex, Karen

Conference

Advanced Metallization Conference

Title

Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect

Publication type

Oral presentation

Embargo date

9999-12-31