Publication:

Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect

Date

2005
Presentation
Simple item page Full metadata Statistics
 
dc.contributor.authorZhang, Wenqi
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorVan Aelst, Joke
dc.contributor.authorRichard, Olivier
dc.contributor.authorBamal, Mandeep
dc.contributor.authorHeylen, Nancy
dc.contributor.authorLi, Yunlong
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorVan Aelst, Joke
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.date.accessioned2021-10-16T07:27:01Z
dc.date.available2021-10-16T07:27:01Z
dc.date.embargo9999-12-31
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11603
dc.source.conferenceAdvanced Metallization Conference
dc.source.conferencedate27/09/2005
dc.source.conferencelocationColorado Springs, CO USA
dc.title

Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect

dc.typeOral presentation
dspace.entity.typePublication
Files

Original bundle

Name:
11004.pdf
Size:
390.18 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Presentations