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Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect
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Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect
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Date
2005
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11004.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Zhang, Wenqi
;
Brongersma, Sywert
;
Van Aelst, Joke
;
Richard, Olivier
;
Bamal, Mandeep
;
Heylen, Nancy
;
Li, Yunlong
;
Beyer, Gerald
;
Maex, Karen
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1954
since deposited on 2021-10-16
Acq. date: 2025-12-16
Citations
Metrics
Views
1954
since deposited on 2021-10-16
Acq. date: 2025-12-16
Citations