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Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines

dc.contributor.authorCarbonell, Laure
dc.contributor.authorVolders, Henny
dc.contributor.authorHaider, A.
dc.contributor.authorHeylen, Nancy
dc.contributor.authorRichard, Olivier
dc.contributor.authorPalmans, Roger
dc.contributor.authorTravaly, Youssef
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBoelen, Pieter
dc.contributor.authorRosenfeld, A.
dc.contributor.authorMandrekar, T.
dc.contributor.authorHernandez, Jose Luis
dc.contributor.authorVanhaelemeersch, Serge
dc.date.accessioned2021-10-16T15:13:16Z
dc.date.available2021-10-16T15:13:16Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11826
dc.sourceIIOimport
dc.titleScaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines
dc.typeOral presentation
dc.contributor.imecauthorVolders, Henny
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorHernandez, Jose Luis
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.source.peerreviewno
dc.source.conferenceAdvanced Metallization Conference: 17th Asian Session - ADMETA
dc.source.conferencedate20/10/2007
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - imec


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