dc.contributor.author | Carbonell, Laure | |
dc.contributor.author | Volders, Henny | |
dc.contributor.author | Haider, A. | |
dc.contributor.author | Heylen, Nancy | |
dc.contributor.author | Richard, Olivier | |
dc.contributor.author | Palmans, Roger | |
dc.contributor.author | Travaly, Youssef | |
dc.contributor.author | Tokei, Zsolt | |
dc.contributor.author | Boelen, Pieter | |
dc.contributor.author | Rosenfeld, A. | |
dc.contributor.author | Mandrekar, T. | |
dc.contributor.author | Hernandez, Jose Luis | |
dc.contributor.author | Vanhaelemeersch, Serge | |
dc.date.accessioned | 2021-10-16T15:13:16Z | |
dc.date.available | 2021-10-16T15:13:16Z | |
dc.date.issued | 2007 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/11826 | |
dc.source | IIOimport | |
dc.title | Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines | |
dc.type | Oral presentation | |
dc.contributor.imecauthor | Volders, Henny | |
dc.contributor.imecauthor | Heylen, Nancy | |
dc.contributor.imecauthor | Richard, Olivier | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.imecauthor | Hernandez, Jose Luis | |
dc.contributor.imecauthor | Vanhaelemeersch, Serge | |
dc.contributor.orcidimec | Richard, Olivier::0000-0002-3994-8021 | |
dc.contributor.orcidimec | Vanhaelemeersch, Serge::0000-0003-2102-7395 | |
dc.source.peerreview | no | |
dc.source.conference | Advanced Metallization Conference: 17th Asian Session - ADMETA | |
dc.source.conferencedate | 20/10/2007 | |
dc.source.conferencelocation | Tokyo Japan | |
imec.availability | Published - imec | |