Toggle navigation
My submissions
Login
Toggle navigation
View item
imec Publications Repository
imec Publications
Presentations
View item
imec Publications Repository
imec Publications
Presentations
View item
JavaScript is disabled for your browser. Some features of this site may not work without it.
Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines
Metadata
Show full item record
Authors
Carbonell, Laure
;
Volders, Henny
;
Haider, A.
;
Heylen, Nancy
;
Richard, Olivier
;
Palmans, Roger
;
Travaly, Youssef
;
Tokei, Zsolt
;
Boelen, Pieter
;
Rosenfeld, A.
;
Mandrekar, T.
;
Hernandez, Jose Luis
;
Vanhaelemeersch, Serge
Conference
Advanced Metallization Conference: 17th Asian Session - ADMETA
Title
Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines
Publication type
Oral presentation
Collections
Presentations
Search imec Publications Repository
This collection
Browse
All of imec Publications Repository
Collections
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
This collection
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
My account
login
NoThumbnail