Publication:

Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines

Date

Loading...
Thumbnail Image

Abstract

Description

Statistics

Views

1988 since deposited on 2021-10-16
2last month
Acq. date: 2026-04-06

Citations

Statistics

Views

1988 since deposited on 2021-10-16
2last month
Acq. date: 2026-04-06

Citations