Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines

dc.contributor.author	Carbonell, Laure
dc.contributor.author	Volders, Henny
dc.contributor.author	Haider, A.
dc.contributor.author	Heylen, Nancy
dc.contributor.author	Richard, Olivier
dc.contributor.author	Palmans, Roger
dc.contributor.author	Travaly, Youssef
dc.contributor.author	Tokei, Zsolt
dc.contributor.author	Boelen, Pieter
dc.contributor.author	Rosenfeld, A.
dc.contributor.author	Mandrekar, T.
dc.contributor.author	Hernandez, Jose Luis
dc.contributor.author	Vanhaelemeersch, Serge
dc.contributor.imecauthor	Volders, Henny
dc.contributor.imecauthor	Heylen, Nancy
dc.contributor.imecauthor	Richard, Olivier
dc.contributor.imecauthor	Tokei, Zsolt
dc.contributor.imecauthor	Hernandez, Jose Luis
dc.contributor.imecauthor	Vanhaelemeersch, Serge
dc.contributor.orcidimec	Richard, Olivier::0000-0002-3994-8021
dc.contributor.orcidimec	Vanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.accessioned	2021-10-16T15:13:16Z
dc.date.available	2021-10-16T15:13:16Z
dc.date.issued	2007
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/11826
dc.source.conference	Advanced Metallization Conference: 17th Asian Session - ADMETA
dc.source.conferencedate	20/10/2007
dc.source.conferencelocation	Tokyo Japan
dc.title	Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines
dc.type	Oral presentation
dspace.entity.type	Publication
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