Publication:

Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines

Date

Loading...
Thumbnail Image

Abstract

Description

Metrics

Views

1984 since deposited on 2021-10-16
Acq. date: 2025-10-23

Citations

Metrics

Views

1984 since deposited on 2021-10-16
Acq. date: 2025-10-23

Citations