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Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines
Publication:
Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines
Date
2007
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Carbonell, Laure
;
Volders, Henny
;
Haider, A.
;
Heylen, Nancy
;
Richard, Olivier
;
Palmans, Roger
;
Travaly, Youssef
;
Tokei, Zsolt
;
Boelen, Pieter
;
Rosenfeld, A.
;
Mandrekar, T.
;
Hernandez, Jose Luis
;
Vanhaelemeersch, Serge
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1984
since deposited on 2021-10-16
Acq. date: 2025-10-23
Citations
Metrics
Views
1984
since deposited on 2021-10-16
Acq. date: 2025-10-23
Citations