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All wet strip approaches for post-etch photoresist layers after low-k patterning

dc.contributor.authorClaes, Martine
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorKesters, Els
dc.contributor.authorLux, Marcel
dc.contributor.authorUrionabarrenetxea, Ainara
dc.contributor.authorVereecke, Guy
dc.contributor.authorMertens, Paul
dc.contributor.authorCarleer, R.
dc.contributor.authorAdriaensens, P.
dc.date.accessioned2021-10-16T15:19:10Z
dc.date.available2021-10-16T15:19:10Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11872
dc.sourceIIOimport
dc.titleAll wet strip approaches for post-etch photoresist layers after low-k patterning
dc.typeProceedings paper
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorMertens, Paul
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage177
dc.source.endpage187
dc.source.conferenceCleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 10
dc.source.conferencedate7/10/2007
dc.source.conferencelocationWashington, DC USA
imec.availabilityPublished - open access
imec.internalnotesECS Trans.; Vol. 11, issue 2


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