Show simple item record

3D integration technology developments at IMEC

dc.contributor.authorDe Moor, Piet
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorSoussan, Philippe
dc.contributor.authorBaert, Kris
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-16T15:32:20Z
dc.date.available2021-10-16T15:32:20Z
dc.date.issued2007-11
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11963
dc.sourceIIOimport
dc.title3D integration technology developments at IMEC
dc.typeProceedings paper
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage301
dc.source.endpage334
dc.source.conference1st Int. IEEE Workshop on Low Temperature Bonding for 3D Integration
dc.source.conferencedate8/11/2007
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
15166.pdf
Size:
9.888Mb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record