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Novel patterning shrink technique enabling sub-50nm trench and contact integration

dc.contributor.authorDemuynck, Steven
dc.contributor.authorTokei, Zsolt
dc.contributor.authorZhao, Chao
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorStruyf, Herbert
dc.contributor.authorBoullart, Werner
dc.contributor.authorOp de Beeck, Maaike
dc.contributor.authorCarbonell, Laure
dc.contributor.authorHeylen, Nancy
dc.contributor.authorVaes, Jan
dc.contributor.authorBeyer, Gerald
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorZhu, Helen
dc.contributor.authorCirigliano, Peter
dc.contributor.authorKim, J. S.
dc.contributor.authorVertommen, Johan
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorSadjadi, R.
dc.contributor.authorPavel, E.
dc.contributor.authorAthayde, A.
dc.date.accessioned2021-10-16T15:46:58Z
dc.date.available2021-10-16T15:46:58Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12050
dc.sourceIIOimport
dc.titleNovel patterning shrink technique enabling sub-50nm trench and contact integration
dc.typeProceedings paper
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorBoullart, Werner
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorVertommen, Johan
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conferenceInternational Symposium on Semiconductor Manufacturing
dc.source.conferencedate15/10/2007
dc.source.conferencelocationSanta Clara, CA USA
imec.availabilityPublished - open access


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