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The effect of delay between dry etch and wet clean processing steps on cleaning of post-etch residues

dc.contributor.authorHellin, David
dc.contributor.authorVos, Ingrid
dc.contributor.authorVereecke, Guy
dc.contributor.authorPavel, E.
dc.contributor.authorBoullart, Werner
dc.contributor.authorVertommen, Johan
dc.date.accessioned2021-10-16T16:33:28Z
dc.date.available2021-10-16T16:33:28Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12267
dc.sourceIIOimport
dc.titleThe effect of delay between dry etch and wet clean processing steps on cleaning of post-etch residues
dc.typeProceedings paper
dc.contributor.imecauthorHellin, David
dc.contributor.imecauthorVos, Ingrid
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorBoullart, Werner
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage283
dc.source.endpage290
dc.source.conferenceCleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 10
dc.source.conferencedate7/10/2007
dc.source.conferencelocationWashington, DC USA
imec.availabilityPublished - open access
imec.internalnotesECS Trans.; Vol. 11, issue 2


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