Publication:
Simultaneous Cu-Cu and compliant dielectric bonding for 3D stacking of ICs
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1865 since deposited on 2021-10-16
1last week
Acq. date: 2026-02-26
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Statistics
Views
1865 since deposited on 2021-10-16
1last week
Acq. date: 2026-02-26
Citations