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Simultaneous Cu-Cu and compliant dielectric bonding for 3D stacking of ICs

dc.contributor.authorJourdain, Anne
dc.contributor.authorStoukatch, Serguei
dc.contributor.authorDe Moor, Piet
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorPargfrieder, S.
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-16T16:59:52Z
dc.date.available2021-10-16T16:59:52Z
dc.date.issued2007-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12373
dc.sourceIIOimport
dc.titleSimultaneous Cu-Cu and compliant dielectric bonding for 3D stacking of ICs
dc.typeProceedings paper
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage207
dc.source.endpage209
dc.source.conferenceProceedings of the IEEE International Interconnect Technology Conference
dc.source.conferencedate4/06/2007
dc.source.conferencelocationBurlingame, CA USA
imec.availabilityPublished - imec


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