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Cleaning of post-etch photoresist layer on patterned surface using organic solvent combined with physical forces

dc.contributor.authorLe, Quoc Toan
dc.contributor.authorChiodarelli, Nicolo
dc.contributor.authorBlum, Ivan
dc.contributor.authorKesters, Els
dc.contributor.authorLux, Marcel
dc.contributor.authorClaes, Martine
dc.contributor.authorVereecke, Guy
dc.contributor.authorMertens, Paul
dc.date.accessioned2021-10-16T17:21:15Z
dc.date.available2021-10-16T17:21:15Z
dc.date.issued2007-04
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12453
dc.sourceIIOimport
dc.titleCleaning of post-etch photoresist layer on patterned surface using organic solvent combined with physical forces
dc.typeProceedings paper
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorMertens, Paul
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.source.peerreviewno
dc.source.conferenceSurface Preparation and Cleaning Conference
dc.source.conferencedate25/04/2007
dc.source.conferencelocationAustin, TX USA
imec.availabilityPublished - imec


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