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Low-temperature enbrittlement of lead-free solders in joint level impact testing

dc.contributor.authorLimaye, Paresh
dc.contributor.authorMaurissen, Wout
dc.contributor.authorLambrinou, Konstantza
dc.contributor.authorDuflos, Frederic
dc.contributor.authorVandevelde, Bart
dc.contributor.authorAllaert, Bart
dc.contributor.authorHillaert, Joost
dc.contributor.authorVandepitte, Dirk
dc.contributor.authorVerlinden, Bert
dc.date.accessioned2021-10-16T17:32:54Z
dc.date.available2021-10-16T17:32:54Z
dc.date.issued2007-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12494
dc.sourceIIOimport
dc.titleLow-temperature enbrittlement of lead-free solders in joint level impact testing
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewyes
dc.source.beginpage140
dc.source.endpage151
dc.source.conference9th Electronics Packaging Conference - EPTC
dc.source.conferencedate10/12/2007
dc.source.conferencelocationSingapore
imec.availabilityPublished - imec


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