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Influence of STI trench fill and dummy design on CMP behavior

dc.contributor.authorOng, Patrick
dc.contributor.authorDevriendt, Katia
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorOkuno, Yasutoshi
dc.contributor.authorHernandez, Jose Luis
dc.date.accessioned2021-10-16T18:19:02Z
dc.date.available2021-10-16T18:19:02Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12645
dc.sourceIIOimport
dc.titleInfluence of STI trench fill and dummy design on CMP behavior
dc.typeProceedings paper
dc.contributor.imecauthorOng, Patrick
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorHernandez, Jose Luis
dc.contributor.orcidimecOng, Patrick::0000-0002-2072-292X
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.source.peerreviewyes
dc.source.beginpage99
dc.source.endpage104
dc.source.conferenceInternational Conference on Planarization / CMP Technology - ICPT
dc.source.conferencedate25/10/2007
dc.source.conferencelocationDresden Germany
imec.availabilityPublished - imec


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