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A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond

dc.contributor.authorOp de Beeck, Maaike
dc.contributor.authorVersluijs, Janko
dc.contributor.authorTokei, Zsolt
dc.contributor.authorDemuynck, Steven
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorBoullart, Werner
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorZhu, Helen
dc.contributor.authorCirigliano, Peter
dc.contributor.authorPavel, Elisabeth
dc.contributor.authorSadjadi, Reza
dc.contributor.authorKim, Jisoo
dc.date.accessioned2021-10-16T18:19:23Z
dc.date.available2021-10-16T18:19:23Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12646
dc.sourceIIOimport
dc.titleA novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond
dc.typeProceedings paper
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorBoullart, Werner
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.source.peerreviewno
dc.source.beginpage65190U
dc.source.conferenceAdvances in Resist Materials and Processing Technology XXIV
dc.source.conferencedate25/02/2007
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - imec
imec.internalnotesSPIE Proceedings; Vol. 6519


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