Integration and packaging MEMS directly above active CMOS

Thumbnail
View/open
Metadata
Show full item record
Authors
Pieters, Philip; Qi, Dan; Witvrouw, Ann
Conference
International Symposium on High Density packaging and Microsystem Integration - HDP
Title
Integration and packaging MEMS directly above active CMOS
Publication type
Proceedings paper
Embargo date
9999-12-31
Collections