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Integration and packaging MEMS directly above active CMOS

dc.contributor.authorPieters, Philip
dc.contributor.authorQi, Dan
dc.contributor.authorWitvrouw, Ann
dc.date.accessioned2021-10-16T18:38:26Z
dc.date.available2021-10-16T18:38:26Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12706
dc.sourceIIOimport
dc.titleIntegration and packaging MEMS directly above active CMOS
dc.typeProceedings paper
dc.contributor.imecauthorPieters, Philip
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage32
dc.source.conferenceInternational Symposium on High Density packaging and Microsystem Integration - HDP
dc.source.conferencedate26/06/2007
dc.source.conferencelocationShanghai China
imec.availabilityPublished - open access


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