Show simple item record

TDDB reliability prediction based on the statistical analysis of hard break-down including multiple soft breakdown and wear out

dc.contributor.authorSahhaf, Sahar
dc.contributor.authorDegraeve, Robin
dc.contributor.authorRoussel, Philippe
dc.contributor.authorKauerauf, Thomas
dc.contributor.authorKaczer, Ben
dc.contributor.authorGroeseneken, Guido
dc.date.accessioned2021-10-16T19:20:46Z
dc.date.available2021-10-16T19:20:46Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12833
dc.sourceIIOimport
dc.titleTDDB reliability prediction based on the statistical analysis of hard break-down including multiple soft breakdown and wear out
dc.typeProceedings paper
dc.contributor.imecauthorSahhaf, Sahar
dc.contributor.imecauthorDegraeve, Robin
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorKaczer, Ben
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecKaczer, Ben::0000-0002-1484-4007
dc.source.peerreviewno
dc.source.beginpage501
dc.source.endpage504
dc.source.conferenceTechnical Digest International Electron Devices Meeting - IEDM
dc.source.conferencedate10/12/2007
dc.source.conferencelocationWashington, DC USA
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record