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The critical role of the metal / porous low-k interface in post direct CMP defectivity generation and resulting ULK surface and bulk hydrophilisation

dc.contributor.authorTravaly, Youssef
dc.contributor.authorSinapi, Fabrice
dc.contributor.authorHeylen, Nancy
dc.contributor.authorHumbert, Aurelie
dc.contributor.authorDelande, Tinne
dc.contributor.authorCaluwaerts, Rudy
dc.contributor.authorGueneau de Mussy, Jean Paul
dc.contributor.authorVereecke, Guy
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorIacopi, Francesca
dc.contributor.authorHernandez, Jose Luis
dc.contributor.authorBeyer, Gerald
dc.contributor.authorFischer, Pamela
dc.date.accessioned2021-10-16T20:15:45Z
dc.date.available2021-10-16T20:15:45Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12989
dc.sourceIIOimport
dc.titleThe critical role of the metal / porous low-k interface in post direct CMP defectivity generation and resulting ULK surface and bulk hydrophilisation
dc.typeProceedings paper
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorHumbert, Aurelie
dc.contributor.imecauthorDelande, Tinne
dc.contributor.imecauthorCaluwaerts, Rudy
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorHernandez, Jose Luis
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecHumbert, Aurelie::0000-0002-2538-8991
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage164
dc.source.endpage166
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate4/06/2007
dc.source.conferencelocationSan Francisco USA
imec.availabilityPublished - open access


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