dc.contributor.author | Tsutsue, Makoto | |
dc.contributor.author | Travaly, Youssef | |
dc.contributor.author | Ikeda, Atsushi | |
dc.contributor.author | Tokei, Zsolt | |
dc.contributor.author | Willegems, Myriam | |
dc.contributor.author | Struyf, Herbert | |
dc.contributor.author | Sinapi, Fabrice | |
dc.contributor.author | Richard, Olivier | |
dc.contributor.author | Kemeling, Nathan | |
dc.contributor.author | De Roest, David | |
dc.contributor.author | Fukuzawa, A. | |
dc.contributor.author | Matsuki, N. | |
dc.contributor.author | Sprey, Hessel | |
dc.contributor.author | Beyer, Gerald | |
dc.date.accessioned | 2021-10-16T20:20:47Z | |
dc.date.available | 2021-10-16T20:20:47Z | |
dc.date.issued | 2007 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/13002 | |
dc.source | IIOimport | |
dc.title | Highly reliable Cu/ULK integratrion scheme using MHM and low-k capping film | |
dc.type | Oral presentation | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.imecauthor | Willegems, Myriam | |
dc.contributor.imecauthor | Struyf, Herbert | |
dc.contributor.imecauthor | Richard, Olivier | |
dc.contributor.imecauthor | Kemeling, Nathan | |
dc.contributor.imecauthor | De Roest, David | |
dc.contributor.imecauthor | Sprey, Hessel | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.orcidimec | Richard, Olivier::0000-0002-3994-8021 | |
dc.source.peerreview | no | |
dc.source.conference | Advanced Metallization Conference - AMC | |
dc.source.conferencedate | 9/10/2007 | |
dc.source.conferencelocation | Albany, NY USA | |
imec.availability | Published - imec | |