Highly reliable Cu/ULK integratrion scheme using MHM and low-k capping film

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Author(s)

Tsutsue, Makoto

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Travaly, Youssef

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Willegems, Myriam

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Struyf, Herbert

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Sinapi, Fabrice

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Richard, Olivier

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Kemeling, Nathan

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De Roest, David

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Metrics

1938 since deposited on 2021-10-16

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Acq. date: 2025-12-08