Highly reliable Cu/ULK integratrion scheme using MHM and low-k capping film

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Authors
Tsutsue, Makoto; Travaly, Youssef; Ikeda, Atsushi; Tokei, Zsolt; Willegems, Myriam; Struyf, Herbert; Sinapi, Fabrice; Richard, Olivier; Kemeling, Nathan; De Roest, David; Fukuzawa, A.; Matsuki, N.; Sprey, Hessel; Beyer, Gerald
Conference
Advanced Metallization Conference - AMC
Title
Highly reliable Cu/ULK integratrion scheme using MHM and low-k capping film
Publication type
Oral presentation
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