Publication:

Highly reliable Cu/ULK integratrion scheme using MHM and low-k capping film

Date

2007
Presentation
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dc.contributor.authorTsutsue, Makoto
dc.contributor.authorTravaly, Youssef
dc.contributor.authorIkeda, Atsushi
dc.contributor.authorTokei, Zsolt
dc.contributor.authorWillegems, Myriam
dc.contributor.authorStruyf, Herbert
dc.contributor.authorSinapi, Fabrice
dc.contributor.authorRichard, Olivier
dc.contributor.authorKemeling, Nathan
dc.contributor.authorDe Roest, David
dc.contributor.authorFukuzawa, A.
dc.contributor.authorMatsuki, N.
dc.contributor.authorSprey, Hessel
dc.contributor.authorBeyer, Gerald
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorWillegems, Myriam
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorKemeling, Nathan
dc.contributor.imecauthorDe Roest, David
dc.contributor.imecauthorSprey, Hessel
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.date.accessioned2021-10-16T20:20:47Z
dc.date.available2021-10-16T20:20:47Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13002
dc.source.conferenceAdvanced Metallization Conference - AMC
dc.source.conferencedate9/10/2007
dc.source.conferencelocationAlbany, NY USA
dc.title

Highly reliable Cu/ULK integratrion scheme using MHM and low-k capping film

dc.typeOral presentation
dspace.entity.typePublication
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