Cu resistivity scaling limits for 20 nm copper damascene lines

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Authors
Van Olmen, Jan; List, Scott; Tokei, Zsolt; Carbonell, Laure; Brongersma, Sywert; Volders, Henny; Kunnen, Eddy; Heylen, Nancy; Ciofi, Ivan; Khandelwal, A.; Gelatos, J.; Mandrekar, T.; Boelen, Pieter
Conference
IEEE International Interconnect Technology Conference - IITC
Title
Cu resistivity scaling limits for 20 nm copper damascene lines
Publication type
Proceedings paper
Embargo date
9999-12-31
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