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Cu resistivity scaling limits for 20 nm copper damascene lines

dc.contributor.authorVan Olmen, Jan
dc.contributor.authorList, Scott
dc.contributor.authorTokei, Zsolt
dc.contributor.authorCarbonell, Laure
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorVolders, Henny
dc.contributor.authorKunnen, Eddy
dc.contributor.authorHeylen, Nancy
dc.contributor.authorCiofi, Ivan
dc.contributor.authorKhandelwal, A.
dc.contributor.authorGelatos, J.
dc.contributor.authorMandrekar, T.
dc.contributor.authorBoelen, Pieter
dc.date.accessioned2021-10-16T20:48:55Z
dc.date.available2021-10-16T20:48:55Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13080
dc.sourceIIOimport
dc.titleCu resistivity scaling limits for 20 nm copper damascene lines
dc.typeProceedings paper
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorVolders, Henny
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage49
dc.source.endpage51
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate4/06/2007
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access


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