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A novel concept for contact etch residue removal

dc.contributor.authorVos, Ingrid
dc.contributor.authorHellin, David
dc.contributor.authorDemuynck, Steven
dc.contributor.authorRichard, Olivier
dc.contributor.authorConard, Thierry
dc.contributor.authorVertommen, Johan
dc.contributor.authorBoullart, Werner
dc.date.accessioned2021-10-16T21:34:23Z
dc.date.available2021-10-16T21:34:23Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13201
dc.sourceIIOimport
dc.titleA novel concept for contact etch residue removal
dc.typeProceedings paper
dc.contributor.imecauthorVos, Ingrid
dc.contributor.imecauthorHellin, David
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorBoullart, Werner
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage403
dc.source.endpage407
dc.source.conferenceCleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 10
dc.source.conferencedate7/10/2007
dc.source.conferencelocationWashington, DC USA
imec.availabilityPublished - open access
imec.internalnotesECS Trans.; Vol. 11; iss. 2


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