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dc.contributor.authorArmini, Silvia
dc.contributor.authorBurtovyy, Ruslan
dc.contributor.authorLuzinov, Igor
dc.contributor.authorWhelan, Caroline
dc.contributor.authorMaex, Karen
dc.contributor.authorMoinpour, Mansour
dc.date.accessioned2021-10-17T06:13:56Z
dc.date.available2021-10-17T06:13:56Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13310
dc.sourceIIOimport
dc.titleInteraction forces between oxide and silica-modified terpolymer abrasive and their impact on CMP and post-CMP
dc.typeProceedings paper
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewyes
dc.source.beginpage169
dc.source.endpage172
dc.source.conferenceUltra Clean Processing of Semiconductor Surfaces VIII - UCPSS
dc.source.conferencedate18/09/2006
dc.source.conferencelocationAntwerpen belgium
dc.identifier.urlhttp://www.scientific.net/
imec.availabilityPublished - imec
imec.internalnotesSolid State Phenomena; Vol. 134


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