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Defectivity in chemical mechanical planarization: A multiscale approach

dc.contributor.authorChandra, A.
dc.contributor.authorBastawros, A. F.
dc.contributor.authorBiswas, R.
dc.contributor.authorSherman, P. J.
dc.contributor.authorArmini, Silvia
dc.date.accessioned2021-10-17T06:28:21Z
dc.date.available2021-10-17T06:28:21Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13493
dc.sourceIIOimport
dc.titleDefectivity in chemical mechanical planarization: A multiscale approach
dc.typeProceedings paper
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewno
dc.source.beginpage107
dc.source.endpage112
dc.source.conferenceProceedings 13th Int. Conference on Chemical-Mechanical Polish (CMP) Planarization for ULSI Multilevel Interconnection - CMP-MIC
dc.source.conferencedate4/03/2008
dc.source.conferencelocationFremont, CA USA
imec.availabilityPublished - imec


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