Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Conference contributions
Functionality and reliability testing of bendable ultrathin chip packages (UTCP's)
Publication:
Functionality and reliability testing of bendable ultrathin chip packages (UTCP's)
Copy permalink
Date
2008
Meeting abstract
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
17350.pdf
140.1 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Christiaens, Wim
;
Torfs, Tom
;
Huwel, W.
;
Vanfleteren, Jan
Journal
Abstract
Description
Statistics
Views
1908
since deposited on 2021-10-17
Acq. date: 2026-07-16
Citations
Statistics
Views
1908
since deposited on 2021-10-17
Acq. date: 2026-07-16
Citations