Functionality and reliability testing of bendable ultrathin chip packages (UTCP's)

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Authors
Christiaens, Wim; Torfs, Tom; Huwel, W.; Vanfleteren, Jan
Conference
Proceedings of the IMAPS Nordic Annual Conference
Title
Functionality and reliability testing of bendable ultrathin chip packages (UTCP's)
Publication type
Meeting abstract
Embargo date
9999-12-31
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