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Functionality and reliability testing of bendable ultrathin chip packages (UTCP's)

dc.contributor.authorChristiaens, Wim
dc.contributor.authorTorfs, Tom
dc.contributor.authorHuwel, W.
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-17T06:32:41Z
dc.date.available2021-10-17T06:32:41Z
dc.date.issued2008-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13525
dc.sourceIIOimport
dc.titleFunctionality and reliability testing of bendable ultrathin chip packages (UTCP's)
dc.typeMeeting abstract
dc.contributor.imecauthorTorfs, Tom
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecTorfs, Tom::0000-0002-1302-3346
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage230
dc.source.conferenceProceedings of the IMAPS Nordic Annual Conference
dc.source.conferencedate14/09/2008
dc.source.conferencelocationHelsingor Denmark
imec.availabilityPublished - open access


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