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Etch challenges brought by the metal hardmask approach for advanced contact patterning with fluorocarbon-based plasma

dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorGoossens, Danny
dc.contributor.authorShamiryan, Denis
dc.contributor.authorLazzarino, Frederic
dc.contributor.authorStruyf, Herbert
dc.contributor.authorBoullart, Werner
dc.date.accessioned2021-10-17T06:44:45Z
dc.date.available2021-10-17T06:44:45Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13605
dc.sourceIIOimport
dc.titleEtch challenges brought by the metal hardmask approach for advanced contact patterning with fluorocarbon-based plasma
dc.typeMeeting abstract
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorGoossens, Danny
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorBoullart, Werner
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.source.peerreviewno
dc.source.conference60th Annual Gaseous Electronics Conference
dc.source.conferencedate13/10/2008
dc.source.conferencelocationDallas, TX US
dc.identifier.urlhttp://absimage.aps.org/image/MWS_GEC08-2008-000177.pdf
imec.availabilityPublished - imec


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