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Controlling scratching in Cu chemical-mechanical planarization (CuCMP)
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Authors
Eusner, T
;
Saka, N
;
Chun, Jung-Hoon
;
Armini, Silvia
;
Moinpour, M
;
Fisher, P. J.
Conference
Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Inter-level Dielectrics
Title
Controlling scratching in Cu chemical-mechanical planarization (CuCMP)
Publication type
Proceedings paper
Embargo date
9999-12-31
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