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Controlling scratching in Cu chemical-mechanical planarization (CuCMP)
Publication:
Controlling scratching in Cu chemical-mechanical planarization (CuCMP)
Date
2008
Proceedings Paper
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17489.pdf
452.84 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Eusner, T
;
Saka, N
;
Chun, Jung-Hoon
;
Armini, Silvia
;
Moinpour, M
;
Fisher, P. J.
Journal
Abstract
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1863
since deposited on 2021-10-17
Acq. date: 2025-10-27
Citations
Metrics
Views
1863
since deposited on 2021-10-17
Acq. date: 2025-10-27
Citations