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Controlling scratching in Cu chemical-mechanical planarization (CuCMP)

dc.contributor.authorEusner, T
dc.contributor.authorSaka, N
dc.contributor.authorChun, Jung-Hoon
dc.contributor.authorArmini, Silvia
dc.contributor.authorMoinpour, M
dc.contributor.authorFisher, P. J.
dc.date.accessioned2021-10-17T07:03:01Z
dc.date.available2021-10-17T07:03:01Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13707
dc.sourceIIOimport
dc.titleControlling scratching in Cu chemical-mechanical planarization (CuCMP)
dc.typeProceedings paper
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage15
dc.source.endpage27
dc.source.conferenceCopper Interconnects, New Contact Metallurgies/Structures, and Low-k Inter-level Dielectrics
dc.source.conferencedate12/10/2008
dc.source.conferencelocationHonolulu, HI USA
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol.16, Issue 19


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