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Conference contributions
Assembly of ultra-thin chip packages (UTCPs) for enhanced flexibility of flexible displays
Publication:
Assembly of ultra-thin chip packages (UTCPs) for enhanced flexibility of flexible displays
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Date
2008-09
Proceedings Paper
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17349.pdf
847.41 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Govaerts, Jonathan
;
Vanfleteren, Jan
Journal
Abstract
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1900
since deposited on 2021-10-17
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Acq. date: 2025-12-10
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Metrics
Views
1900
since deposited on 2021-10-17
1
last month
Acq. date: 2025-12-10
Citations