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Assembly of ultra-thin chip packages (UTCPs) for enhanced flexibility of flexible displays

dc.contributor.authorGovaerts, Jonathan
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-17T07:22:49Z
dc.date.available2021-10-17T07:22:49Z
dc.date.issued2008-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13800
dc.sourceIIOimport
dc.titleAssembly of ultra-thin chip packages (UTCPs) for enhanced flexibility of flexible displays
dc.typeProceedings paper
dc.contributor.imecauthorGovaerts, Jonathan
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecGovaerts, Jonathan::0000-0002-8908-1198
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage309
dc.source.endpage313
dc.source.conferenceProceedings of the 2nd Electronics System Integration Technology Conference - ESTC
dc.source.conferencelocationGreenwich UK
imec.availabilityPublished - open access


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