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Particle removal efficiency and damage analysis of patterned wafers in different solvents after megasonic cleaning

dc.contributor.authorHalder, Sandip
dc.contributor.authorBearda, Twan
dc.contributor.authorKenis, Karine
dc.contributor.authorJanssens, Tom
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorWostyn, Kurt
dc.contributor.authorLeunissen, Peter
dc.contributor.authorMertens, Paul
dc.date.accessioned2021-10-17T07:30:55Z
dc.date.available2021-10-17T07:30:55Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13835
dc.sourceIIOimport
dc.titleParticle removal efficiency and damage analysis of patterned wafers in different solvents after megasonic cleaning
dc.typeOral presentation
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorKenis, Karine
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorWostyn, Kurt
dc.contributor.imecauthorMertens, Paul
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecWostyn, Kurt::0000-0003-3995-0292
dc.source.peerreviewno
dc.source.conference11th Iternational Symposium on Particles on Surfaces: Detection, Adhesion and Removal
dc.source.conferencedate16/07/2008
dc.source.conferencelocationOrono, ME USA
imec.availabilityPublished - imec


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