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Post-direct-CMP dielectric surface copper contamination: quantitative analysis and impact on dielectric breakdown behaviour

dc.contributor.authorHeylen, Nancy
dc.contributor.authorLi, Yunlong
dc.contributor.authorTravaly, Youssef
dc.contributor.authorVereecke, Guy
dc.contributor.authorVolders, Henny
dc.contributor.authorTokei, Zsolt
dc.contributor.authorVersluijs, Janko
dc.contributor.authorRip, Jens
dc.contributor.authorBeyer, Gerald
dc.contributor.authorFischer, Paul
dc.contributor.authorZhao, Larry
dc.contributor.authorSantoro, Gaetano
dc.contributor.authorNguyen, Olivier
dc.contributor.authorCockburn, Andrew
dc.date.accessioned2021-10-17T07:40:31Z
dc.date.available2021-10-17T07:40:31Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13874
dc.sourceIIOimport
dc.titlePost-direct-CMP dielectric surface copper contamination: quantitative analysis and impact on dielectric breakdown behaviour
dc.typeMeeting abstract
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorVolders, Henny
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.imecauthorRip, Jens
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSantoro, Gaetano
dc.contributor.imecauthorCockburn, Andrew
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.source.peerreviewno
dc.source.conferenceAdvanced Metallization Conference - AMC
dc.source.conferencedate23/09/2008
dc.source.conferencelocationSan Diego, CA CA
imec.availabilityPublished - imec


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