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Silicone for flexible packaging of thin dies (<20 μm) using wafer level techniques

dc.contributor.authorIker, Francois
dc.contributor.authorDe Preter, Inge
dc.contributor.authorGonzalez, Mario
dc.contributor.authorSoussan, Philippe
dc.date.accessioned2021-10-17T07:50:19Z
dc.date.available2021-10-17T07:50:19Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13914
dc.sourceIIOimport
dc.titleSilicone for flexible packaging of thin dies (<20 μm) using wafer level techniques
dc.typeProceedings paper
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.source.peerreviewyes
dc.source.conference13th Meeting of the Symposium on Polymers for Microelectronics
dc.source.conferencedate7/05/2008
dc.source.conferencelocationWilmington, DE USA
imec.availabilityPublished - imec


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