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Technology platform for 3-D stacking of thinned embedded dies

dc.contributor.authorIker, Francois
dc.contributor.authorSoussan, Philippe
dc.contributor.authorBeyne, Eric
dc.contributor.authorBaert, Kris
dc.date.accessioned2021-10-17T07:50:34Z
dc.date.available2021-10-17T07:50:34Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13915
dc.sourceIIOimport
dc.titleTechnology platform for 3-D stacking of thinned embedded dies
dc.typeProceedings paper
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage8
dc.source.endpage11
dc.source.conference58th Electronic Components abd Technology Conference - ECTC
dc.source.conferencedate27/05/2008
dc.source.conferencelocationLake Buena Vista, FL USA
imec.availabilityPublished - open access


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