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Pattern collapse and particle removal forces of interest to semiconductor fabrication process

dc.contributor.authorKim, Tae-Gon
dc.contributor.authorWostyn, Kurt
dc.contributor.authorPark, Jin-Park
dc.contributor.authorMertens, Paul
dc.contributor.authorBusnaina, Ahmed A.
dc.date.accessioned2021-10-17T08:00:13Z
dc.date.available2021-10-17T08:00:13Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13952
dc.sourceIIOimport
dc.titlePattern collapse and particle removal forces of interest to semiconductor fabrication process
dc.typeOral presentation
dc.contributor.imecauthorWostyn, Kurt
dc.contributor.imecauthorMertens, Paul
dc.contributor.orcidimecWostyn, Kurt::0000-0003-3995-0292
dc.source.peerreviewno
dc.source.conference9th International Symposium on Ultra Clean Processing of Semiconductor Surfaces - UCPSS
dc.source.conferencedate21/09/2008
dc.source.conferencelocationBruges Belgium
imec.availabilityPublished - imec


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