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Interactions of double patterning technology with wafer processing, OPC and design flows

dc.contributor.authorLucas, Kevin
dc.contributor.authorCork, Chris
dc.contributor.authorMiloslavsky, Alex
dc.contributor.authorLuk-Pat, Gerry
dc.contributor.authorBarnes, Levi
dc.contributor.authorHapli, John
dc.contributor.authorLewellen, John
dc.contributor.authorRollins, Greg
dc.contributor.authorWiaux, Vincent
dc.contributor.authorVerhaegen, Staf
dc.date.accessioned2021-10-17T08:34:20Z
dc.date.available2021-10-17T08:34:20Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14073
dc.sourceIIOimport
dc.titleInteractions of double patterning technology with wafer processing, OPC and design flows
dc.typeProceedings paper
dc.contributor.imecauthorWiaux, Vincent
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage692403
dc.source.conferenceOptical Microlithography XXI
dc.source.conferencedate24/02/2008
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - open access
imec.internalnotesProceedings of SPIE; Vol. 6924


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